Electronics

The world of electronics is fast moving and always changing. Nagase partners with customers to produce the next generation of technologies in electronics and semiconductor assembly. In fact, our electronics materials are found in many leading smart phones and tablets currently on the market.

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We leverage the strengths of our group companies, such as Engineered Materials Systems and Nagase ChemteX, to provide multifaceted solutions. Partner with Nagase to innovate your brand for success.

Light-Emitting Diode (LED) Materials

Die Attach Adhesives

Featuring electrically conductive adhesives, thermally conductive/electrically conductive adhesives and transparent adhesives for die attach applications.

Photoresists

Dry Film Negative Photoresists for Laminating

Four series of photoresists featuring various thicknesses, excellent tenting characteristics and improved hydrophobicity

Liquid Negative Photo Resists for Spin Coating

For spin coating applications and available in a variety of viscosities.

Printed Electronics Materials

Adhesives

In various grades and formulations customized to your application.

Electric Conductive Ink for Printed Electronics

In various grades and formulations customized to your application.

Dielectric Inks

In various grades and formulations customized to your application.

Electrical Conductive Paste

In various grades and formulations customized to your application.

Encapsulants

In various grades and formulations customized to your application.

Semiconductor Materials and Equipment

Electrically Conductive Die Attach Adhesives

In various grades and formulations customized to your application.

High Thermal Conductivity, Electrically Conductive Die Attach Adhesives

In various grades and formulations customized to your application.

Conductive Adhesives for Circuit Assembly

In various grades and formulations customized to your application.

Low Cost Electrically Conductive Adhesives (Reduced Silver Content)

In various grades and formulations customized to your application.

Chip-on-Board Encapsulants

In various grades and formulations customized to your application.

Flex Circuit and Printer Head Assembly Adhesives

In various grades and formulations customized to your application.

Thermally Conductive / Electrically Insulating Adhesives

In various grades and formulations customized to your application.

UV Cure Assembly Adhesives and Encapsulants

In various grades and formulations customized to your application.