
Electronics

Light-Emitting Diode (LED) Materials

Featuring electrically conductive adhesives, thermally conductive/electrically conductive adhesives and transparent adhesives for die attach applications.
Photoresists

Four series of photoresists featuring various thicknesses, excellent tenting characteristics and improved hydrophobicity

For spin coating applications and available in a variety of viscosities.
Photoresists for Lift-off

For compound semiconductors and available for various requirements.
Printed Electronics Materials

In various grades and formulations customized to your application.

In various grades and formulations customized to your application.

In various grades and formulations customized to your application.
Semiconductor Materials and Equipment

In various grades and formulations customized to your application.

In various grades and formulations customized to your application.

In various grades and formulations customized to your application.

EPOLEAD PB3600 is a premium resin modifier that imparts flexibility and improves impact resistance characteristics in cured products without negatively impacting adhesiveness when formulated with polyamine and/or anhydride curing agents. Additional benefits include: Lower epoxy-equivalent weight compared to conventional epoxidized polybutadienes Contains both epoxy groups and vinyl groups in the molecule, with terminal hydroxyl groups

In various grades and formulations customized to your application.

In various grades and formulations customized to your application.

In various grades and formulations customized to your application.