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UV Cure Assembly Adhesives and Encapsulants

by: Engineered Materials Systems, Inc. (Nagase Group)

UV Cure Assembly Adhesives and Encapsulants

We offer a variety of cure assembly adhesives and encapsulants for UV applications. We are committed to partnering with customers to create customized solutions.

XNR5516Z(D) is a fast curing adhesive material with an extremely low water vapor transmission rate. To learn more about this product, please click here.

Additional Information

XNR5516Z(D)
Property Items Method XNR5516Z Series
Viscosity(25C) (10rpm) Brookfield 120 Pa・s
Tg DMA 102C
Water Vapor transmission rate 60C/90RH% MOCON T=100um 20 g/m2・24hr
Peel Strength(25C) Glass-Glass 5.6N/mm


Other UV Cure Assembly Adhesives and Encapsulants
Product Description Viscosity, 0.5rpm Viscosity, 5.0rpm Tg, °C CTE, Alpha I ( CTE, Alpha II (>Tg), µm/(m·°C) Cure UV Cure (mJ/cm2) UV Options
DC-4261 Thermal/UV Curable Epoxy Encapsulant, DAM material 40,000 10,000 112 68 170 Dual- UV/Thermal 2000-5000 LED, Hg
DC-4262 Thermal/UV Curable Epoxy Encapsulant, Fill (potting) material N/A 2,000 112 68 170 Dual- UV/Thermal 2000-5000 LED, Hg

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