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UV Cure Assembly Adhesives and Encapsulants
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We offer a variety of cure assembly adhesives and encapsulants for UV applications. We are committed to partnering with customers to create customized solutions.
XNR5516Z(D) is a fast curing adhesive material with an extremely low water vapor transmission rate. To learn more about this product, please click here.
Additional Information
XNR5516Z(D)| Property Items | Method | XNR5516Z Series |
|---|---|---|
| Viscosity(25C) (10rpm) | Brookfield | 120 Pa・s |
| Tg | DMA | 102C |
| Water Vapor transmission rate | 60C/90RH% MOCON T=100um | 20 g/m2・24hr |
| Peel Strength(25C) | Glass-Glass | 5.6N/mm |
Other UV Cure Assembly Adhesives and Encapsulants
| Product | Description | Viscosity, 0.5rpm | Viscosity, 5.0rpm | Tg, °C | CTE, Alpha I (| CTE, Alpha II (>Tg), µm/(m·°C) |
Cure |
UV Cure (mJ/cm2) |
UV Options |
|
|---|---|---|---|---|---|---|---|---|---|
| DC-4261 | Thermal/UV Curable Epoxy Encapsulant, DAM material | 40,000 | 10,000 | 112 | 68 | 170 | Dual- UV/Thermal | 2000-5000 | LED, Hg |
| DC-4262 | Thermal/UV Curable Epoxy Encapsulant, Fill (potting) material | N/A | 2,000 | 112 | 68 | 170 | Dual- UV/Thermal | 2000-5000 | LED, Hg |
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