We offer a variety of high thermal conductivity, electrically conductive die attach adhesives for circuit assembly applications. We are committed to partnering with customers to create customized solutions.
High Thermal Conductivity, Electrically Conductive Die Attach Adhesives
|Product||Description||Resistivity (ohm•cm)|| Tg (˚C)
|DA-5933A||High thermal conductivity (21W/m°K),ionically clean die attach for power devices and LED's||9.0 x 10-5||107||7,500||Pin transfer Dispense|
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.
- EPOLEAD PB3600
- Photoresists for Lift-off
- UV Cure Assembly Adhesives and Encapsulants
- Dielectric Inks
- Electric Conductive Ink for Printed Electronics
- Thermally Conductive / Electrically Insulating Adhesives
- Low Cost Electrically Conductive Adhesives (Reduced Silver Content)
- Conductive Adhesives