Die Attach Adhesives

Featuring electrically conductive adhesives, thermally conductive/electrically conductive adhesives and transparent adhesives for die attach applications.

Dry Film Negative Photoresists for Laminating

Four series of photoresists featuring various thicknesses, excellent tenting characteristics and improved hydrophobicity

Liquid Negative Photo Resists for Spin Coating

For spin coating applications and available in a variety of viscosities.

Photoresists for Lift-off

For compound semiconductors and available for various requirements.

Dielectric Inks

In various grades and formulations customized to your application.

Electric Conductive Ink for Printed Electronics

In various grades and formulations customized to your application.

Encapsulants

In various grades and formulations customized to your application.

UV Cure Assembly Adhesives and Encapsulants

In various grades and formulations customized to your application.

Conductive Adhesives

In various grades and formulations customized to your application.

Electrically Conductive Die Attach Adhesives

In various grades and formulations customized to your application.

EPOLEAD PB3600

EPOLEAD PB3600 is a premium resin modifier that imparts flexibility and improves impact resistance characteristics in cured products without negatively impacting adhesiveness when formulated with polyamine and/or anhydride curing agents. Additional benefits include: Lower epoxy-equivalent weight compared to conventional epoxidized polybutadienes Contains both epoxy groups and vinyl groups in the molecule, with terminal hydroxyl groups

High Thermal Conductivity, Electrically Conductive Die Attach Adhesives

In various grades and formulations customized to your application.

Low Cost Electrically Conductive Adhesives (Reduced Silver Content)

In various grades and formulations customized to your application.

Thermally Conductive / Electrically Insulating Adhesives

In various grades and formulations customized to your application.