We offer a variety of electrically conductive die attach adhesives for circuit assembly applications. We are committed to partnering with customers to create customized solutions.
Electrically Conductive Die Attach Adhesives
|Product||Description||Resistivity (ohm•cm)|| Tg (˚C)
|DA-5100||General purpose chip on board die attach adhesive||5 x 10-4||115||17,000||Dispense|
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.
- EPOLEAD PB3600
- Photoresists for Lift-off
- UV Cure Assembly Adhesives and Encapsulants
- Dielectric Inks
- Electric Conductive Ink for Printed Electronics
- Thermally Conductive / Electrically Insulating Adhesives
- Low Cost Electrically Conductive Adhesives (Reduced Silver Content)
- Conductive Adhesives