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Conductive Adhesives for Circuit Assembly

by: Engineered Materials Systems, Inc. (Nagase Group)

Conductive Adhesives for Circuit Assembly

We offer a variety of conductive adhesives for circuit assembly applications.  We are committed to partnering with customers to create customized solutions.

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Conductive Adhesives for Circuit Assembly

Product Description Resistivity (ohm•cm)    Tg (˚C)
Tan Delta
(5.0 rpm)
Application   Method
CA-102 High Tg die attach for small die and LED's   8 x 10-5 125 7,000 Screen print
 DB-1538-2 2 part,  2 min @180˚C cure   2 x 10-4 50 11,000 Meter-mix dispense
 DB-1541 Flexible, high peel strength, Damp heat  stability on tin and OSP treated copper.   1 x 10-4 13 33,000 Stencil Print
 DB-1541-S3 Flexible, high peel strenth   1 x 10-4 0 10,000 Dispense
 DB-1548-1 High shear strength, moderate Tg      Conductivity stability on tin, nickel, gold   3 x 10-4 60 10,000 Dispense
 DB-1541-LTC Low temperature cure version (100˚C) for  temperature sensitive devices, moderate Tg, high peel     2 x 10-4  50 17,000 Dispense
 529-144 Carbon filled conductive adhesive for static drain applications     2 x 101  20 20,000 Dispense

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