Die Attach Adhesives

We offer a variety of die attach adhesives for LED applications. We are committed to partnering with customers to create customized solutions.

Additional Information

Electrically Conductive Die Attach Adhesives

Product	Description	Resistivity (ohm•cm)	Thermal Conductivity (W/m°K)	Tg (˚C)Tan Delta	Viscosity(cps) (5.0 rpm)	Application Method
DA-5100	General purpose chip on board die attach adhesive	5 x 10^-4	2	115	17,000	Dispense

High Thermal Conductivity, Electrically Conductive Die Attach Adhesives

Product	Description	Resistivity (ohm•cm)	Thermal Conductivity (W/m°K)	Tg (˚C)Tan Delta	Viscosity(cps) (5.0 rpm)	Application Method
DA-5933A	High thermal conductivity (21W/m°K) die attach for power devices and LED's, very low ionics	9.0 x 10^-5	21	136	7,500	Pin transfer Dispense
DA-5990-1	Thermal conductivity, high adhesion, Jedec L3	N/A		136	12,000	Dispense

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.