Quick Links
XNR5516Z(D)
(click to enlarge)
UV Curable Adhesive and Encapsulant by:
Engineered Materials Systems, Inc. (Nagase Group)
XNR5516Z(D) is a 100% solid epoxy-based adhesive that’s specifically formulated to bond glass. After curing with traditional UV lamps, it exhibits extremely low water vapor transmission, making it ideal for encapsulating organic materials and optical devices.
XNR5516Z(D) is manufactured by Engineered Materials Systems (EMS) in Ohio, US. This material is stocked and ready to bring its unique properties to your glass-sealing and electronics applications. XNR5516Z series is also made in Japan and China using the same recipe.
Performance Advantages
XNR5516Z(D) exhibits several high-performance properties, including:- Excellent adhesion to glass
- Fast curing under UV light
- Extremely low water vapor transmission rate
Applications
XNR5516Z(D) cures quickly, providing strong adhesion and effective encapsulation for:- Electrochromic displays
- Image sensors
- Optical devices
- Organic semiconductor
- OLED displays (in combination with glass)
- E-paper devices (in combination with glass)
- Organic photovoltaic solar cells (glass-to-glass encapsulation)
Product Specifications
XNR5516Z(D)| Property Items | Method | XNR5516Z Series |
|---|---|---|
| Viscosity(25C) (10rpm) | Brookfield | 120 Pa・s |
| Tg | DMA | 102C |
| Water Vapor transmission rate | 60C/90RH% MOCON T=100um | 20 g/m2・24hr |
| Peel Strength(25C) | Glass-Glass | 5.6N/mm |
Related Products
-
EPOLEAD PB3600
-
Photoresists for Lift-off
-
UV Cure Assembly Adhesives and Encapsulants
-
Encapsulants
-
Dielectric Inks
-
Electric Conductive Ink for Printed Electronics
-
Thermally Conductive / Electrically Insulating Adhesives
-
Low Cost Electrically Conductive Adhesives (Reduced Silver Content)
-
Conductive Adhesives
-
High Thermal Conductivity, Electrically Conductive Die Attach Adhesives
