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High Thermal Conductivity, Electrically Conductive Die Attach Adhesives
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High Thermal Conductivity, Electrically Conductive Die Attach Adhesives
| Product | Description | Resistivity (ohm•cm) | Tg (˚C) Tan Delta |
Viscosity(cps) (5.0 rpm) |
Application Method |
|---|---|---|---|---|---|
| DA-5933A | High thermal conductivity (21W/m°K),ionically clean die attach for power devices and LED's | 9.0 x 10-5 | 107 | 7,500 | Pin transfer Dispense |
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.
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