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Electrically Conductive Die Attach Adhesives
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Electrically Conductive Die Attach Adhesives
| Product | Description | Resistivity (ohm•cm) | Tg (˚C) Tan Delta |
Viscosity(cps) (5.0 rpm) |
Application Method |
|---|---|---|---|---|---|
| DA-5100 | General purpose chip on board die attach adhesive | 5 x 10-4 | 115 | 17,000 | Dispense |
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.
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