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High Thermal Conductivity, Electrically Conductive Die Attach Adhesives
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We offer a variety of high thermal conductivity, electrically conductive die attach adhesives for circuit assembly applications. We are committed to partnering with customers to create customized solutions.
Additional Information
High Thermal Conductivity, Electrically Conductive Die Attach Adhesives
| Product | Description | Resistivity (ohm•cm) | Tg (˚C) Tan Delta |
Viscosity(cps) (5.0 rpm) |
Application Method |
|---|---|---|---|---|---|
| DA-5933A | High thermal conductivity (21W/m°K),ionically clean die attach for power devices and LED's | 9.0 x 10-5 | 107 | 7,500 | Pin transfer Dispense |
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.
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