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Low Cost Electrically Conductive Adhesives (Reduced Silver Content)
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Low Cost Electrically Conductive Adhesives (Reduced Silver Content)
Product | Description | Resistivity (ohm•cm) | Tg (˚C) Tan Delta |
Viscosity(cps) (5.0 rpm) |
Application Method |
---|---|---|---|---|---|
DB-1588-4 | Flexible, low cost, excellent adhesion and 85˚C/85% RH performance on OSP treated copper | 2 x 10-4 | 0 | 35,000 | Stencil Print |
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.