Low Cost Electrically Conductive Adhesives (Reduced Silver Content)

by: Engineered Materials Systems, Inc. (Nagase Group)

Low Cost Electrically Conductive Adhesives (Reduced Silver Content)

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Additional Information

Low Cost Electrically Conductive Adhesives (Reduced Silver Content)

Product Description Resistivity (ohm•cm)  Tg (˚C)
Tan Delta
 Viscosity(cps)
(5.0 rpm)
Application   Method
 DB-1588-4 Flexible, low cost, excellent adhesion and 85˚C/85% RH performance on OSP treated copper   2 x 10-4 0 35,000  Stencil Print

 

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.

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