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With over 50+ years of automotive manufacturing innovation, we offer a variety of durable encapsulations for automotive electronic applications. Our encapsulations range from Potting, Underfill and Dam/Fill, and are specifically engineered to provide advanced resistance to thermal shock, vibrations, moisture, and corrosive agents. This allows for the highest-level of protection for the semiconductor chip, solder, wire bonding, and other components. Our materials are uniquely designed to be completely customizable based on any application needs. We are committed to partnering with manufacturers to create one-of-a-kind, customized solutions.

Related Products

• Dam/Fill
• Potting
• Black Diamond
• Low Cost Electrically Conductive Adhesives (Reduced Silver Content)
• Conductive Adhesives
• Teisan Resin Low Tg Acrylic Esters
• Thermally Conductive Adhesives
• Thermally Conductive Grease
• Epoxy Adhesives
• Synthetic Leather

Related Industries

• Automotive