Nagase America

Quick Links

Epoxy Encapsulations

50+ years of automotive manufacturing innovation, we offer a variety of durable encapsulations for automotive electronic applications.

Our encapsulations range from Potting, Underfill and Dam/Fill, and are specifically engineered to provide advanced resistance to thermal shock, vibrations, moisture, and corrosive agents. This allows for the highest-level of protection for the semiconductor chip, solder, wire bonding, and other components.

Our materials are uniquely designed to be completely customizable based on any application needs. We are committed to partnering with manufacturers to create one-of-a-kind, customized solutions.



  • Epoxy potting material for power module, ECU, and traction motor
  • 200°C Resistant
  • Crack Resistant
  • High Thermal Conductivity


  • Durable solder protection for Ball Grid Array (BGA) and other semiconductor package components
  • Applicable for big BGA (Low CTE)
  • Long Pot Life
  • Flux Compatible
  • Quick gelation for double-sided PCB


  • Partially potting solution for housing-less modules
  • Dam and Fill can be cured at the same time
  • Quick Cure

    Which Product(s) Would You Like More Information About?