50+ years of automotive manufacturing innovation, we offer a variety of durable encapsulations for automotive electronic applications.

Our encapsulations range from Potting, Underfill and Dam/Fill, and are specifically engineered to provide advanced resistance to thermal shock, vibrations, moisture, and corrosive agents. This allows for the highest-level of protection for the semiconductor chip, solder, wire bonding, and other components.

Our materials are uniquely designed to be completely customizable based on any application needs. We are committed to partnering with manufacturers to create one-of-a-kind, customized solutions.

 

Potting	Epoxy potting material for power module, ECU, and traction motor 200°C Resistant Crack Resistant High Thermal Conductivity
Underfill	Durable solder protection for Ball Grid Array (BGA) and other semiconductor package components Applicable for big BGA (Low CTE) Long Pot Life Flux Compatible Quick gelation for double-sided PCB
Dam/Fill	Partially potting solution for housing-less modules Dam and Fill can be cured at the same time Quick Cure