Thermally Conductive Adhesives
Additional Information
Thermally Conductive Adhesives for Automotive Applications
Product | Description | Viscosity (cps) | Tg - DMA(°C) | Cure | Thermal Conductivity (W/m0K) |
---|---|---|---|---|---|
XNR3631N-3(D) | High-thermal conductive, one-component epoxy adhesive | 300,000 | 80 | 30 min @ 140°C | 3.2 |
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.