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Potting
by: Nagase ChemteX
Product Features
- Epoxy potting material for power module, ECU, and traction motor
- 200°C Resistant
- Crack Resistant
- High Thermal Conductivity
Benefit of Epoxy Potting — Solder/Wire Bonding Protection
CTE mismatch between Chip/Ceramic and Ceramic/Base Plate creates stress on solder or wire bonding during thermal cycle. The stress increases as junction temperature increases from 125°C to 175°C. Our Epoxy Potting materials provide high crack resistance at elevated temperatures and, consequently, extend part life.
Product Information
Products |
Resin |
629-3A |
XNR5025 |
R-1981-1GS |
R-4900-2GS |
XNR4175 |
|
Hardener |
629-3B |
XNH5021 |
H-1980 |
H-1980 |
XNH4175 |
||
Features |
Standard Low Viscosity |
Flame retardants Low CTE |
High Tg Low modulus High adhesion |
High Tg Low CTE High adhesion |
High thermal conductivity |
||
Mixing Ratio (R/H) |
wt% |
100 ： 100 |
100 ： 100 |
100 : 125 |
100 : 80 |
100 : 60 |
|
Cure Condition (Standard Condition) |
150℃/1hr |
100℃/1hr + 150℃/3hr |
90℃/1.5hr + 180℃/2hr |
90℃/1.5hr + 180℃/2hr |
100C/1hr + 150C/3hr |
||
Resin Viscosity (25℃) |
25℃ |
Pa・s |
11 |
100 |
230 |
400 |
364 |
Hardener Viscosity (25℃) |
25℃ |
Pa・s |
0.9 |
6 |
21 |
21 |
13 |
Mixture Viscosity |
60℃ |
Pa・s |
0.8 |
3 |
6 |
10 |
4.8 |
Gelation Time |
100℃ |
min |
- |
25 |
33 (90℃) |
33 (90℃) |
12 |
Tg (DSC) |
℃ |
158 |
167 |
201 |
205 |
163C |
|
Flexural Modulus (DMA) |
25℃ |
GPa |
13 |
17 |
11 |
18 |
16 |
Die shear strength (Cu) |
25℃ |
N/mm2 |
- |
12 |
19 |
19 |
- |
CTE (TMA) |
<Tg |
10-6K-1 |
23 |
15 |
17 |
12 |
14 |
Other properties |
US and China production |
3.2 mm V-0 |
New(Development) 6.4mm V-0 (Internal test) |
New(Development) 6.4mm V-0 (Internal test) |
Thermal conductivity 1.0W/m・K |
||
Synthetic Leather 