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Epoxy Potting Materials

by: Engineered Materials Systems, Inc. (Nagase Group)

Epoxy Potting Materials

We offer a variety of potting materials for automotive applications. Potting materials are materials that are created poured into potted circuit boards to provide resistance to shock, vibrations, moisture and corrosive agents. Our potting materials are unique and customer-specific. We are committed to partnering with customers to create customized solutions.

Additional Information

Epoxy Potting Materials for Automotive Applications

Product Description Viscosity (cps) Tg - DMA(°C) Cure Lap Share Strength(AL/AL)
505-82A/B Volumetric 1:1 mix ratio,  two-component epoxy potting material 7,500 48 24 h @ 25°C <Tg: 77,  >Tg: 146
SP2059A/600-72B UL 94V-O low viscosity, room-temperature (RT) cure epoxy for electronics 600 No Data 24 h @ 25°C No Data
702-96A/600-80B UL 94V-O low-viscosity heat cure epoxy for electronics 1,200 No Data 24 h @ 25 °C No Data
569-05A/B High-Tg (240C) and low CTE (15ppm)  two component epoxy potting materials 24,000 220 1 h @ 150°C + 30 min @ 220°C <Tg: 15,  >Tg: 84
T800R901(D)/T800H901(D) Thermally conductive, two-component epoxy potting material 88,000 167 1 h @ 100°C + 3 h @ 150°C <Tg: 13,  >Tg: 55
XNR5021(D)/XNH5021(D) High Tg (169 °C) and low CTE (15 ppm) two-part epoxy potting materials 27,000 167 1 h @ 100°C + 3 h @1 50°C <Tg:15,  >Tg:58
XNR4708B(D)/XNH4708-10(D) Two-component epoxy varnish material 9,000 170 2h @ 100°C+ 30 min @ 80°C <Tg: 40,  >Tg: 120
T544/R802(D)  One-component epoxy varnish material with viscosity stability (1 week @ °25C) 9,000 173 10 min @ 150°C + 10 min @ 180°C No Data

 

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.

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