by: Engineered Materials Systems, Inc. (Nagase Group)
We offer a variety of conductive adhesives for circuit assembly applications. We are committed to partnering with customers to create customized solutions.
|Product||Description||Tg (˚C)Tan Delta||Viscosity(cps) (5.0 rpm)||Application Method|
|561-147-1||Cost effective conductive adhesive for solar cell singling and ribbon attach. Provides IEC/thermal cycle reliability, jet dispensability, snap cure and high adhesion.||90||11,000||Jet dispense|
|CA-178||Conductive adhesive for solar cell singling and ribbon attach. Provides IEC/thermal cycle reliability, snap cure, high adhesion and stable electrical conductivity.||97||22,000||Stencil|
Conductive Adhesives for Back Contact Applications
|Product||Description||Resistivity (ohm•cm)||Tg (˚C)
|Viscosity cP (5.0 s-1)||Application Method|
|DB-1588-4||Lowest cost of the DB-1588-series materials. Faster cure for fast cure EVA encapsulants||2 x 10-4||0||35,000||Stencil Print|
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.