We offer a variety of potting materials for automotive applications. Potting materials are materials that are created poured into potted circuit boards to provide resistance to shock, vibrations, moisture and corrosive agents. Our potting materials are unique and customer-specific. We are committed to partnering with customers to create customized solutions.
Epoxy Potting Materials for Automotive Applications
|Product||Description||Viscosity (cps)||Tg - DMA(°C)||Cure||Lap Share Strength(AL/AL)|
|505-82A/B||Volumetric 1:1 mix ratio, two-component epoxy potting material||7,500||48||24 h @ 25°C||<Tg: 77, >Tg: 146|
|XNR5021(D)/XNH5021(D)||High Tg (169 °C) and low CTE (15 ppm) two-part epoxy potting materials||27,000||167||1 h @ 100°C + 3 h @1 50°C||<Tg:15, >Tg:58|
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.
- Black Diamond
- Low Cost Electrically Conductive Adhesives (Reduced Silver Content)
- Conductive Adhesives
- Teisan Resin Low Tg Acrylic Esters
- Thermally Conductive Adhesives
- Thermally Conductive Grease
- Epoxy Adhesives
- Synthetic Leather
- Polyurethane Molded Foam
- Injection and Blow-Mold Tooling and Capital Equipment