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UV Cure Assembly Adhesives and Encapsulants

by: Engineered Materials Systems, Inc. (Nagase Group)

UV Cure Assembly Adhesives and Encapsulants

We offer a variety of cure assembly adhesives and encapsulants for UV applications.  We are committed to partnering with customers to create customized solutions.

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UV Cure Assembly Adhesives and Encapsulants 

Product Description Viscosity (cps) Tg - DMA  ( 0C) Cure Thermal Conductivity  W/m0K
535-32 Low viscosity epoxy adhesive/encapsulant, contains secondary thermal cure 1,200 2 UV +20 min @ 1100C 0.3
535-10M-1  High viscosity epoxy adhesive/encapsulant, contains secondary thermal cure 400,000 5 UV + 20 min @ 1100C 0.3
535-18M-57 Medium viscosity with faster cure speed 75,000 5 UV 0.3

 

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