We offer a variety of low temperature cure adhesives for photovoltaic cells and module materials applications. We are committed to partnering with customers to create customized solutions.
Low Temperature Cure Conductive Adhesives
|Product||Description||Resistivity (ohm•cm)||Tg (˚C)
|Viscosity cP (5.0 s-1)||Application Method|
|DB-1541-LTC||Low temperature cure version (100˚C) for organic PV and other temperature sensitive modules||2 x 10-4||50||17,000||Needle Dispense|
|DB-1569||Low temperature cure (90% cured is 30 min @ 80˚C)||3 x 10-4||30||10,000||Needle Dispense|
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.