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Low Temperature Cure Conductive Adhesives

by: Engineered Materials Systems, Inc. (Nagase Group)

Low Temperature Cure Conductive Adhesives

We offer a variety of low temperature cure adhesives for photovoltaic cells and module materials applications.  We are committed to partnering with customers to create customized solutions.

Additional Information

Low Temperature Cure Conductive Adhesives

Product Description Resistivity (ohm•cm) Tg (˚C)
Tan Delta
Viscosity  cP  (5.0 s-1) Application Method
DB-1541-LTC Low temperature cure version (100˚C) for organic PV and other temperature sensitive modules     2 x 10-4  50 17,000 Needle Dispense
DB-1569 Low temperature cure (90% cured is 30 min @ 80˚C)     3 x 10-4  30 10,000 Needle Dispense

 

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.

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