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High Thermal Conductivity, Electrically Conductive Die Attach Adhesives

by: Engineered Materials Systems, Inc. (Nagase Group)

High Thermal Conductivity, Electrically Conductive Die Attach Adhesives

We offer a variety of high thermal conductivity, electrically conductive die attach adhesives for circuit assembly applications.  We are committed to partnering with customers to create customized solutions.

Additional Information

High Thermal Conductivity, Electrically Conductive Die Attach Adhesives

Product Description Resistivity (ohm•cm)  Tg (˚C)
Tan Delta
Viscosity(cps)
(5.0 rpm)
Application Method
CA-190 High thermal conductivity (20W/mK), ionically clean, long open time die attach for small die and LED   5.0 x 10-5 135 11,000 Pin transfer   Dispense
CA-195 Low cost, high thermal conductivity (15W/mK), ionically clean, long open time die attach for small die and LED   6.0 x 10-5 135 11,000 Pin transfer   Dispense
 DA-5045-2 High thermal conductivity (20W/m°K) die attach for LED's and small die   1.0 x 10-4 139 10,500 Pin transfer   Dispense
 DA-5933A High thermal conductivity (21W/m°K),ionically clean die attach for power devices and LED's   9.0 x 10-5 107 7,500 Pin transfer   Dispense

 

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.

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