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Flex Circuit and Printer Head Assembly Adhesives

by: Engineered Materials Systems, Inc. (Nagase Group)

Flex Circuit and Printer Head Assembly Adhesives

We offer a variety of adhesives for flex circuit and printer head assembly applications.  We are committed to partnering with customers to create customized solutions.

Additional Information

Flex Circuit and Printer Head Assembly Adhesives

Product Description Viscosity (cps) Tg - DMA Cure Pot Life at 25°C (hrs)
357-348 White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance 9,500 50 60 min @ 800C5 min @ 1500C 72 Hours
357-346-5 White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance 20,000 60 60 min @ 800C3 min @ 1500C 72 Hours
357-284 White, high thixotropy adhesive, encapsulant, bonding FR4 to kapton and stainless steel, high fracture toughness, high ink and moisture resistance 110,000 65 40 min @ 800C1 min @ 1500C 72Hours
EN-7150 Tan, low-viscosity adhesive, encapsulant, bonding FR4 to kapton and stainless steel, high fracture toughness, high ink and moisture resistance, high Tg 15,000 106 30 min @ 1100C 72 Hours

 

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.

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