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Electrically Conductive Die Attach Adhesives

by: Engineered Materials Systems, Inc. (Nagase Group)

Electrically Conductive Die Attach Adhesives

We offer a variety of electrically conductive die attach adhesives for circuit assembly applications.  We are committed to partnering with customers to create customized solutions.

Additional Information

Electrically Conductive Die Attach Adhesives

Product Description Resistivity (ohm•cm)  Tg (˚C)
Tan Delta
Viscosity(cps)
(5.0 rpm)
Application Method
 CA-105 High Tg, low cost die attach for small die and LED's 3 x 10-4 135 11,000 Dispense
 DA-5845-GB Chip on board, meets NASA outgassing requirements   2 x 10-4 65 25,000  Dispense
 DA-5100 General purpose chip on board die attach adhesive   5 x 10-4 115 17,000  Dispense
 DB-1568 Low temperature cure (90% cured 30 minutes at 80°C), snap cure at 150°C plus   5 x 10-4 40 25,000 Stencil print
 CA-180 Low temperature cure (cured 15 minutes at 80°C), snap cure at 150°C plus (2 seconds @ 200°C)   6 x 10-5 50 12,000  Dispense

 

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.

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