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Die Attach Adhesives

by: Engineered Materials Systems, Inc. (Nagase Group)

Die Attach Adhesives

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We offer a variety of die attach adhesives for LED applications.  We are committed to partnering with customers to create customized solutions.

Additional Information

Electrically Conductive Die Attach Adhesives

Product Description Resistivity (ohm•cm) Thermal Conductivity (W/m°K) Tg (˚C)Tan Delta  Viscosity(cps)   (5.0 rpm) Application Method
 DA-5100 General purpose chip on board die attach adhesive   5 x 10-4 2 115 17,000  Dispense

 

High Thermal Conductivity,  Electrically Conductive Die Attach Adhesives

Product Description Resistivity (ohm•cm) Thermal Conductivity (W/m°K) Tg (˚C)Tan Delta  Viscosity(cps)   (5.0 rpm) Application Method
 DA-5933A High thermal conductivity (21W/m°K) die attach for power devices and LED's, very low ionics   9.0 x 10-5 21 136 7,500 Pin transfer   Dispense
DA-5990-1 Thermal conductivity, high adhesion, Jedec L3 N/A   136 12,000 Dispense

 

 

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.

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