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Die Attach Adhesives

by: Engineered Materials Systems, Inc. (Nagase Group)

Die Attach Adhesives

We offer a variety of die attach adhesives for LED applications.  We are committed to partnering with customers to create customized solutions.

Additional Information

Electrically Conductive Die Attach Adhesives

Product Description Resistivity (ohm•cm) Thermal Conductivity (W/m°K) Tg (˚C)Tan Delta  Viscosity(cps)   (5.0 rpm) Application Method
 CA-105 High Tg, low cost die attach for small die and LED's 3 x 10-4 Not tested 135 11,000 Dispense
 DA-5100 General purpose chip on board die attach adhesive   5 x 10-4 2 115 17,000  Dispense
 DA-5845-GB Chip on board LED/die attach, meets NASA outgassing requirements   2 x 10-4 2 65 25,000  Dispense

 

High Thermal Conductivity,  Electrically Conductive Die Attach Adhesives

Product Description Resistivity (ohm•cm) Thermal Conductivity (W/m°K) Tg (˚C)Tan Delta  Viscosity(cps)   (5.0 rpm) Application Method
CA-190 High thermal conductivity, ionically clean, long open time die attach for small die and LED   5.0 x 10-5 20 135 11,000 Pin transfer   Dispense
CA-195 Low cost, high thermal conductivity, ionically clean, long open time die attach for small die and LED   6.0 x 10-5 15 135 11,000 Pin transfer   Dispense
 DA-5045-2 High thermal conductivity (20W/m°K) die attach for LED's and small die   1.0 x 10-4 20 139 10,500 Pin transfer   Dispense
 DA-5933A High thermal conductivity (21W/m°K) die attach for power devices and LED's, very low ionics   9.0 x 10-5 21 107 7,500 Pin transfer   Dispense

 

Thermally Conductive/Electrically Insulating Die Attach Adhesives

Product Description Resistivity (ohm•cm) Thermal Conductivity (W/m°K) Tg (˚C)Tan Delta  Viscosity(cps)   (5.0 rpm) Application Method
 TM-6162 Electrically insulating, low outgassing die attach with good viscosity stability N/A 2.2 75 25,000 Dispense

 

Transparent LED Die Attach/Encapsulants

Product Description Cure Tg (˚C)
Tan Delta
 Viscosity(cps)   (5.0 rpm) Application   Method
DA-5011 Transparent, fast cure   10 min @ 180° C 195 7,000 Dispense
 DA-5887-9 Transparent LED die attach adhesive or encapsulant 10 min @ 150° C 134 12,000 Dispense

 

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.

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