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Conductive Adhesives for Circuit Assembly

by: Engineered Materials Systems, Inc. (Nagase Group)

Conductive Adhesives for Circuit Assembly

We offer a variety of conductive adhesives for circuit assembly applications.  We are committed to partnering with customers to create customized solutions.

Additional Information

Conductive Adhesives for Circuit Assembly

Product Description Resistivity (ohm•cm)    Tg (˚C)
Tan Delta
 Viscosity(cps)
(5.0 rpm)
Application   Method
CA-102 High Tg die attach for small die and LED's   8 x 10-5 125 7,000 Screen print
 DB-1538-2 2 part,  2 min @180˚C cure   2 x 10-4 50 11,000 Meter-mix dispense
 DB-1541 Flexible, high peel strength, Damp heat  stability on tin and OSP treated copper.   1 x 10-4 13 33,000 Stencil Print
 DB-1541-S3 Flexible, high peel strenth   1 x 10-4 0 10,000 Dispense
 DB-1548-1 High shear strength, moderate Tg      Conductivity stability on tin, nickel, gold   3 x 10-4 60 10,000 Dispense
 DB-1541-LTC Low temperature cure version (100˚C) for  temperature sensitive devices, moderate Tg, high peel     2 x 10-4  50 17,000 Dispense
 529-144 Carbon filled conductive adhesive for static drain applications     2 x 101  20 20,000 Dispense

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