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Conductive Adhesives for Back Contact Applications

by: Engineered Materials Systems, Inc. (Nagase Group)

Conductive Adhesives for Back Contact Applications

We offer a variety of conductive adhesives for back contact applications.  We are committed to partnering with customers to create customized solutions.

Additional Information

Conductive Adhesives for Back Contact Applications

Product Description Resistivity (ohm•cm) Tg (˚C)

Tan Delta

Viscosity  cP  (5.0 s-1) Application Method
DB-1541 Flexible, high peel strength, Damp heat  stability on tin and OSP treated copper. Designed to cure during EVA lamination   1 x 10-4 13 33,000 Stencil    Print
DB-1588-1 Lowest cost, flexible, excellent damp heat performance on OSP treated copper.   4 x 10-4 5 30,000 Stencil     Print
DB-1588-2 Low cost, flexible, excellent damp heat performance on OSP treated copper. Lowest cost.   4 x 10-4 5 30,000 Stencil     Print
DB-1588-3 Needle dispensible or jet version of DB-1588-4   2 x 10-4 0 20,000 Needle Dispense, Jet
DB-1588-4 Lowest cost of the DB-1588-series materials. Faster cure for fast cure EVA encapsulants   2 x 10-4 0 35,000 Stencil     Print
DB-1588-5 Slower cure for longer laminations   2 x 10-4 0 35,000 Stencil     Print

 

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.

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