We offer a variety of conductive adhesives for back contact applications. We are committed to partnering with customers to create customized solutions.
Conductive Adhesives for Back Contact Applications
|Product||Description||Resistivity (ohm•cm)||Tg (˚C)
|Viscosity cP (5.0 s-1)||Application Method|
|DB-1541||Flexible, high peel strength, Damp heat stability on tin and OSP treated copper. Designed to cure during EVA lamination||1 x 10-4||13||33,000||Stencil Print|
|DB-1588-1||Lowest cost, flexible, excellent damp heat performance on OSP treated copper.||4 x 10-4||5||30,000||Stencil Print|
|DB-1588-2||Low cost, flexible, excellent damp heat performance on OSP treated copper. Lowest cost.||4 x 10-4||5||30,000||Stencil Print|
|DB-1588-3||Needle dispensible or jet version of DB-1588-4||2 x 10-4||0||20,000||Needle Dispense, Jet|
|DB-1588-4||Lowest cost of the DB-1588-series materials. Faster cure for fast cure EVA encapsulants||2 x 10-4||0||35,000||Stencil Print|
|DB-1588-5||Slower cure for longer laminations||2 x 10-4||0||35,000||Stencil Print|
Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.