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Chip-on-Board Encapsulants

by: Engineered Materials Systems, Inc. (Nagase Group)

Chip-on-Board Encapsulants

We offer a variety of encapsulants for chip-on-board applications.  We are committed to partnering with customers to create customized solutions.

Additional Information

Chip-on-Board Encapsulants 

Product Description Viscosity (cps) Tg - DMA Cure Pot Life at 25°C (hrs)
EN-7826-M Glob top encapsulant, user friendly pot life (> 2 days), superior environmental protection with enhanced moisture resistance and internal stress relief.  CTE = 18ppm below Tg. Controlled flow, domed appearance 140°C 30 min @ 1500C >48 Hrs
DE-7826 Dam fill material, matches cavity properties, user friendly pot life (>2 days), superior environmental protection with enhanced moisture resistance and internal stress relief.  CTE = 18ppm below Tg. Smooth thixotropic paste 140 °C 30 min @ 1500C >48 Hrs
CE-7826 Cavity fill material, matches dam properties, excellent flow properties, user friendly pot life (> 2 days), superior environmental protection with enhanced moisture resistance and internal stress relief.  CTE = 18ppm below Tg. Self-leveling liquid 140 °C 30 min @ 1500C >48 Hrs
408-14 Chip-on-board glob top encapsulant for laminate substrates CTE= 35ppm below Tg.  Fast cure. Controlled flow, domed appearance 120 °C 10 min @ 1200C or 3 min @ 1600C 3 months
EN-7500-S Silicone glob top encapsulant, room temperature stable, excellent adhesion and very good tear properties. 28,000 -121°C 30 min @ 1500C 3 months
DE-7520-S Silicone dam-fill material, matches cavity properties, room temperature stable, excellent adhesion and very good tear properties. 168,000 -121 °C 30 min @ 1500C 3 months
CE-7510-S Silicone cavity fill material, matches dam properties, excellent flow properties, room temperature stable, excellent adhesion and very good tear properties. 750 -121 °C 30 min @ 1500C 3 months

 

Engineered Materials Systems, Inc., a Nagase group company, is a global formulator and manufacturer of adhesives, conductives and encapsulants.

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